Chemical Name: N-(β-aminoethyl)-γ-aminopropylmethyl-dimethoxysilane
Structural Formula: TDS
Equivalent: Dow Corning Z-6023,Momentive A-2120,Evonik 1411,SHinEtsu KBM-602,Wacker GF95
|Appearance:||Colorless transparent liquid|
|Specific Gravity (ρ20°C, g/cm3):||0.965|
|Refractive Index (nD25)||1.444|
|Boiling Point (°C)||234|
|Flash Point (°C)||110|
Silane HENGDA-M8252 may be used as an additive, meeting the need of special primers in numerous bonding applications. It can display a good adhesion in the following systems：
RTV Silicones and Hybrid Silane-Crosslinked Sealants
It can improve the adhesion of single & double component silicone-crosslinked sealants to a variety of substrates, including glass, aluminum and concrete. Silane HENGDA-M8252 provides enhanced adhesion performance without negative influence on rate of elongation. The addition is 0.5 to 1.0 percent of fillers by weight.
When added to single-double component polysulfide sealants, silane HENGDA-M8252 provides better adhesion to a variety of substrates, including glass, aluminum and steel. The addition of HENGDA-M8252 is typically 0.5 to 1.0 percent of the sealant by weight. It disperses well in the sealant and produces cohesive failure in the sealant rather than adhesive failure of the bond between the sealant and the substrate.
As a replacement of polyaminoamide adhesion promoter in plastic sealants, it can improve bonding to metal substrates. In addition to increasing strength, the silane-modified plastic sealants have a better performance than systems those use polyaminoamide adhesion promoter. HENGDA-M8252 modified systems have a very light color and the cured compound is bubble-free.
Additive in Phenolic and Epoxy Molding Compounds
Silane HENGDA-M8252, as an additive in phenolic and epoxy molding compounds, reduces the water absorption of molded composites. So it can improve wet electrical properties, particularly at low frequencies.
25 kg, 200kg plastic or iron drum