Vinyl Terminated Silicone Fluids are key to formulating high-performance Thermal Interface Materials (TIMs) like gap fillers and thermally conductive gels. In these applications, the fluid is loaded with high levels of functional fillers (e.g., alumina, boron nitride) to achieve thermal conductivity.

The vinyl functionality is crucial for the curing process:

Cure-on-Demand: The platinum catalyst allows for a controlled pot life, after which the material cures into a soft, compliant solid.

Low Modulus: The resulting elastomer is soft enough to conform to microscopic irregularities on heat sink and component surfaces, minimizing thermal resistance.

Non-Pump-Out: The crosslinked network prevents the material from migrating or pumping out under thermal cycling, ensuring long-term reliability in electronics cooling for CPUs, GPUs, and power conversion modules.