The unique combination of vinyl reactivity and PDMS flexibility makes these fluids ideal for:

Underfill applications: CTE matching (250-300 ppm/°C) prevents die stress in flip-chip packages

LED encapsulation: Maintains >90% light transmission after 1000h UV exposure

Flexible circuit coatings: 5000+ bend cycles without cracking at 50μm thickness

New formulations incorporating phenyl-vinyl copolymers demonstrate 40% better gamma radiation resistance for aerospace electronics.